MT41J128M16JT-093:K is a DDR3 SDRAM. It uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR3 SDRAM effectively consists of a single 8n-bit-wide, four-clock cycle data transfer at the internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O pins. The differential data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the DDR3 SDRAM input receiver. DQS is centre-aligned with data for WRITEs. The read data is transmitted by the DDR3 SDRAM and edge-aligned to the data strobes. Read and write accesses to the DDR3 SDRAM are burst-oriented. Accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.
- 128M16 configuration, tCK = 0.938ns, CL = 14 cycle time
- Differential bidirectional data strobe, 8n-bit prefetch architecture
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS READ latency (CL), posted CAS additive latency (AL)
- Programmable CAS WRITE latency (CWL) based on tCK
- Self refresh temperature (SRT), automatic self refresh (ASR), write levelling
- Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])
- Industrial temperature range from -40°C to +95°C
- Package style is 96-ball FBGA
Product details
DRAM Type:
DDR3
|
Memory Density:
2Gbit
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Memory Configuration:
128M x 16bit
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Clock Frequency Max:
1.066GHz
|
IC Case / Package:
FBGA
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No. of Pins:
96Pins
|
Supply Voltage Nom:
1.5V
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IC Mounting:
Surface Mount
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Operating Temperature Min:
0°C
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Operating Temperature Max:
95°C
|
Product Range:
-
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MSL:
MSL 3 - 168 hours
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Other details
Brand |
MICRON |
Part Number |
MT41J128M16JT-093:K |
Quantity |
Each |
Technical Data Sheet EN |
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