| ₹ 6300.76 includes GST and import duties. | |
| B2B customers can avail ₹ 960.87 ITC on this product | |
| 100% Secure Payments | 100% Genuine product |
Description
No-clean, lead-free, thermally stable solder paste in 50g jar.
- Printing speeds up to 125mm/sec.
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- T4 mesh
- No refrigeration required
- Alloy: Sn96/Ag3/Cu0.5
Product details
| Flux Type | Synthetic No Clean |
| Solder Alloy | 96.5, 3, 0.5 Sn, Ag, Cu |
| Melting Temperature | 220°C |
| Weight - Metric | 50g |
| Weight - Imperial | 1.76oz |
| Product Range | - |
Other details
| Brand | CHIP QUIK |
| Part Number | TS391SNL50 |
| Quantity | Each |
| Technical Data Sheet EN |  |
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Bulk Discount
| Quantity | Price |
| 2 | ₹ 6174.74 |
| 3-5 | ₹ 6111.74 |
| 5-10 | ₹ 5985.72 |
| 10+ | ₹ 5859.71 |
Bulk discount will be automatically applied during checkout based on quantity.