| ₹ 4404.66 includes GST and import duties. | |
| B2B customers can avail ₹ 671.71 ITC on this product | |
| 100% Secure Payments | 100% Genuine product |
Description
No-clean, lead-free, low temperature thermally stable solder paste in 50g jar.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- No refrigeration required
- Alloy: Sn42/Bi57.6/Ag0.4
Product details
| Flux Type | Synthetic No Clean |
| Solder Alloy | 42, 57.6, 0.4 Sn, Bi, Ag |
| Melting Temperature | 138°C |
| Weight - Metric | 50g |
| Weight - Imperial | 1.76oz |
| Product Range | - |
Other details
| Brand | CHIP QUIK |
| Part Number | TS391LT50 |
| Quantity | Each |
| Technical Data Sheet EN |  |
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Bulk Discount
| Quantity | Price |
| 2 | ₹ 4316.57 |
| 3-5 | ₹ 4272.52 |
| 5-10 | ₹ 4184.43 |
| 10+ | ₹ 4096.33 |
Bulk discount will be automatically applied during checkout based on quantity.