Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is a highly conformable gel-like modulus.
- Eliminates air gaps to reduce thermal resistance
- Highly conformable to reduce interfacial resisitance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
- Supplied in a 100 x 100mm sheet
Product details
| Thermal Conductivity |
1W/m.K |
| Conductive Material |
- |
| Thickness |
5.08mm |
| Thermal Impedance |
- |
| Dielectric Strength |
- |
| External Length |
- |
| External Width |
100mm |
| Product Range |
- |
Other details
| Brand |
BERGQUIST |
| Part Number |
GPVOUS-0.200-00-4/4 |
| Quantity |
Each |
| Technical Data Sheet EN |
 |
| Manufacturer Catalogue EN |
|
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